US Patent No: 7,804,985

Number of patents in Portfolio can not be more than 2000

Circuit module having force resistant construction

ALSO PUBLISHED AS: 20080308924

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Abstract

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Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
OVID DATA CO. LLCWILMINGTON, DE132

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Orris, Ron Austin, TX 8 4
Partridge, Julian Austin, TX 53 305
Szewerenko, Leland Austin, TX 35 73

Cited Art Landscape

Patent Info (Count) # Cites Year
 
OVID DATA CO. LLC (28)
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5,612,570 Chip stack and method of making same 178 1995
5,654,877 Lead-on-chip integrated circuit apparatus 81 1995
5,778,522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 51 1996
5,783,464 Method of forming a hermetically sealed circuit lead-on package 55 1997
5,869,353 Modular panel stacking process 133 1997
6,205,654 Method of manufacturing a surface mount package 83 1998
6,310,392 Stacked micro ball grid array packages 48 1998
6,323,060 Stackable flex circuit IC package and method of making same 111 1999
6,288,907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 60 1999
6,262,895 Stackable chip package with flex carrier 157 2000
6,351,029 Stackable flex circuit chip package and method of making same 71 2000
6,608,763 Stacking system and method 37 2000
6,360,433 Universal package and method of forming the same 64 2000
6,919,626 High density integrated circuit module 71 2001
6,462,408 Contact member stacking system and method 47 2001
6,473,308 Stackable chip package with flex carrier 86 2001
6,426,240 Stackable flex circuit chip package and method of making same 75 2001
6,514,793 Stackable flex circuit IC package and method of making same 66 2001
6,627,984 Chip stack with differing chip package types 77 2001
6,576,992 Chip scale stacking system and method 100 2001
7,081,373 CSP chip stack with flex circuit 22 2001
6,572,387 Flexible circuit connector for stacked chip module 72 2002
6,940,729 Integrated circuit stacking system and method 23 2002
6,908,792 Chip stack with differing chip package types 53 2002
6,914,324 Memory expansion and chip scale stacking system and method 73 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (22)
4,884,237 Stacked double density memory module using industry standard memory chips 177 1989
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5,198,965 Free form packaging of specific functions within a computer system 82 1991
5,241,454 Mutlilayered flexible circuit package 127 1992
5,243,133 Ceramic chip carrier with lead frame or edge clip 57 1992
5,229,916 Chip edge interconnect overlay element 119 1992
5,343,366 Packages for stacked integrated circuit chip cubes 102 1992
5,313,097 High density memory module 132 1992
5,384,690 Flex laminate package for a parallel processor 27 1993
5,337,388 Matrix of pluggable connectors for connecting large numbers of clustered electrical and/or opticcal cables to a module 44 1993
5,396,573 Pluggable connectors for connecting large numbers of electrical and/or optical cables to a module through a seal 29 1993
5,523,619 High density memory structure 133 1993
5,502,333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit 203 1994
5,620,782 Method of fabricating a flex laminate package 31 1995
6,336,262 Process of forming a capacitor with multi-level interconnection technology 72 1997
5,926,369 Vertically integrated multi-chip circuit package with heat-sink support 108 1998
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6,444,490 Micro-flex technology in semiconductor packages 41 2001
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6,225,688 Stacked microelectronic assembly and method therefor 197 1999
6,465,893 Stacked chip assembly 111 2000
6,765,288 Microelectronic adaptors, assemblies and methods 73 2002
6,897,565 Stacked packages 24 2002
7,149,095 Stacked microelectronic assemblies 37 2002
6,940,158 Assemblies having stacked semiconductor chips and methods of making same 37 2003
6,977,440 Stacked packages 33 2003
6,873,039 Methods of making microelectronic packages including electrically and/or thermally conductive element 12 2003
7,053,485 Microelectronic packages with self-aligning features 13 2003
7,246,431 Methods of making microelectronic packages including folded substrates 15 2003
7,071,547 Assemblies having stacked semiconductor chips and methods of making same 34 2003
6,978,538 Method for making a microelectronic interposer 13 2003
2004/0075,991 Vapor phase connection techniques 39 2003
2004/0217,471 Component and assemblies with ends offset downwardly 39 2004
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6,265,660 Package stack via bottom leaded plastic (BLP) packaging 78 2000
6,884,653 Folded interposer 80 2001
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6,500,697 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes 18 2001
6,560,117 Packaged microelectronic die assemblies and methods of manufacture 173 2001
6,709,893 Interconnections for a semiconductor device and method for forming same 45 2001
6,559,521 Chip carrier with magnetic shielding 24 2002
2003/0164,551 Method and apparatus for flip-chip packaging providing testing capability 39 2002
 
SAMSUNG ELECTRONICS CO., LTD. (15)
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6,849,949 Thin stacked package 45 2000
6,452,826 Memory module system 116 2001
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6,614,664 Memory module having series-connected printed circuit boards 76 2001
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6,891,729 Memory module 33 2002
6,876,074 Stack package using flexible double wiring substrate 61 2002
6,812,567 Semiconductor package and package stack made thereof 38 2003
2005/0040,508 Area array type package stack and manufacturing method thereof 41 2004
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2005/0133,897 Stack package with improved heat radiation and module having the stack package mounted thereon 68 2004
 
ROUND ROCK RESEARCH, LLC (11)
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5,899,705 Stacked leads-over chip multi-chip module 109 1998
6,072,233 Stackable ball grid array package 316 1998
6,368,896 Method of wafer level chip scale packaging 151 1999
6,165,817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections 47 1999
6,265,766 Flip chip adaptor package for bare die 148 2000
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6,462,423 Flip-chip with matched lines and ground plane 61 2000
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INTEL CORPORATION (8)
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6,532,162 Reference plane of integrated circuit packages 27 2001
6,600,222 Stacked microelectronic packages 163 2002
6,869,825 Folded BGA package design with shortened communication paths and more electrical routing flexibility 39 2002
6,841,855 Electronic package having a flexible substrate with ends connected to one another 27 2003
 
FREESCALE SEMICONDUCTOR, INC. (7)
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5,239,198 Overmolded semiconductor device having solder ball and edge lead connective structure 315 1992
5,386,341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 164 1993
5,789,815 Three dimensional semiconductor package having flexible appendages 104 1996
6,040,624 Semiconductor device package and method 96 1997
6,111,761 Electronic assembly 24 1999
 
NEC CORPORATION (7)
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5,717,556 Printed-wiring board having plural parallel-connected interconnections 84 1996
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6,166,443 Semiconductor device with reduced thickness 38 1999
6,998,704 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus 32 2003
 
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6,084,778 Three dimensional assembly using flexible wiring board 30 1998
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6,489,178 Method of fabricating a molded package for micromechanical devices 69 2001
2002/0114,143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates 34 2002
6,858,910 Method of fabricating a molded package for micromechanical devices 18 2002
 
FUJITSU LIMITED (6)
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6,102,710 Controlled impedance interposer substrate and method of making 42 1998
6,187,652 Method of fabrication of multiple-layer high density substrate 78 1998
6,444,921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like 107 2000
6,690,584 Information-processing device having a crossbar-board connected to back panels on different sides 78 2001
6,521,530 Composite interposer and method for producing a composite interposer 118 2001
 
SEIKO EPSON CORPORATION (6)
6,486,544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument 100 2000
6,670,700 Interconnect substrate and semiconductor device electronic instrument 36 2001
6,677,670 Semiconductor device 69 2001
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6,646,335 Flexible tape carrier with external terminals formed on interposers 33 2002
 
RAMBUS INC. (5)
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6,833,984 Semiconductor module with serial bus connection to multiple dies 104 2002
 
APROLASE DEVELOPMENT CO., LLC (4)
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6,028,352 IC stack utilizing secondary leadframes 106 1998
 
KABUSHIKI KAISHA TOSHIBA (4)
5,394,303 Semiconductor device 240 1993
6,492,718 Stacked semiconductor device and semiconductor system 105 2000
6,528,870 Semiconductor device having a plurality of stacked wiring boards 84 2001
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QIMONDA AG (4)
6,646,333 Semiconductor module having interconnected semiconductor chips disposed one above the other 16 2000
6,538,895 TSOP memory chip housing configuration 21 2002
6,724,076 Package for a semiconductor chip 28 2003
7,023,701 Device for cooling memory modules 55 2004
 
URENSCHI ASSETS LIMITED LIABILITY COMPANY (4)
5,953,215 Apparatus and method for improving computer memory speed and capacity 182 1998
6,266,252 Apparatus and method for terminating a computer memory bus 115 1999
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AMP Incorporated (3)
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4,696,525 Socket for stacking integrated circuit packages 104 1985
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HITACHI, LTD. (3)
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MITSUBISHI DENKI KABUSHIKI KAISHA (3)
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MOTOROLA, INC. (3)
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5,289,346 Peripheral to area adapter with protective bumper for an integrated circuit chip 113 1993
 
SUMITOMO ELECTRIC INDUSTRIES, LTD. (1)
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SUN MICROSYSTEMS, INC. (1)
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TALON RESEARCH, LLC (1)
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TEKTRONIX, INC. (1)
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TEMIC AUTOMOTIVE OF NORTH AMERICA, INC. (1)
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Tessers, Inc. (1)
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THE REGENTS OF THE UNIVERSITY OF CALIFORNIA (1)
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THOMAS & BETTS CORPORATION (1)
4,406,508 Dual-in-line package assembly 58 1981
 
TROVE TECHNOLOGY INCORPORATED, 7752 STEFFENSEN DRIVE, SALT LAKE CITY, UT 84121 A CORP. OF UT (1)
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TTA WIRELESS TRANSFER CO., LLC (1)
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U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE (1)
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ULTRATERA CORPORATION (1)
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YAMAICHI ELECTRONICS CO., LTD. (1)
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Other [Check patent profile for assignment information] (11)
4,763,188 Packaging system for multiple semiconductor devices 201 1987
5,016,138 Three dimensional integrated circuit package 301 1989
5,281,852 Semiconductor device including stacked die 163 1991
5,397,916 Semiconductor device including stacked die 134 1993
5,751,553 Thin multichip module including a connector frame socket having first and second apertures 135 1995
2001/0013,423 FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER 105 1997
5,949,657 Bottom or top jumpered foldable electronic assembly 108 1998
6,392,162 Double-sided flexible jumper assembly and method of manufacture 64 2000
2002/0006,032 Low-profile registered DIMM 71 2001
6,509,639 Three-dimensional stacked semiconductor package 87 2002
7,291,906 Stack package and fabricating method thereof 9 2003

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