US Patent No: 7,804,985

Number of patents in Portfolio can not be more than 2000

Circuit module having force resistant construction

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ALSO PUBLISHED AS: 20080308924
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
OVID DATA CO. LLCWILMINGTON, DE132

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Orris, Ron Austin, TX 6 4
Partridge, Julian Austin, TX 44 239
Szewerenko, Leland Austin, TX 30 62

Cited Art

Patent Info (Count) # Cites Year
 
OVID DATA CO. LLC (28)
5,484,959 High density lead-on-package fabrication method and apparatus 128 1992
5,572,065 Hermetically sealed ceramic integrated circuit heat dissipating package 94 1994
5,804,870 Hermetically sealed integrated circuit lead-on package configuration 69 1995
5,612,570 Chip stack and method of making same 172 1995
5,654,877 Lead-on-chip integrated circuit apparatus 81 1995
5,778,522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 51 1996
5,783,464 Method of forming a hermetically sealed circuit lead-on package 54 1997
5,869,353 Modular panel stacking process 131 1997
6,205,654 Method of manufacturing a surface mount package 80 1998
6,310,392 Stacked micro ball grid array packages 47 1998
6,323,060 Stackable flex circuit IC package and method of making same 111 1999
6,288,907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief 60 1999
6,262,895 Stackable chip package with flex carrier 153 2000
6,351,029 Stackable flex circuit chip package and method of making same 71 2000
6,608,763 Stacking system and method 36 2000
6,360,433 Universal package and method of forming the same 64 2000
6,919,626 High density integrated circuit module 71 2001
6,462,408 Contact member stacking system and method 45 2001
6,473,308 Stackable chip package with flex carrier 81 2001
6,426,240 Stackable flex circuit chip package and method of making same 74 2001
6,514,793 Stackable flex circuit IC package and method of making same 66 2001
6,627,984 Chip stack with differing chip package types 77 2001
6,576,992 Chip scale stacking system and method 97 2001
7,081,373 CSP chip stack with flex circuit 21 2001
6,572,387 Flexible circuit connector for stacked chip module 72 2002
6,940,729 Integrated circuit stacking system and method 22 2002
6,908,792 Chip stack with differing chip package types 51 2002
6,914,324 Memory expansion and chip scale stacking system and method 71 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (22)
4,884,237 Stacked double density memory module using industry standard memory chips 157 1989
5,159,535 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate 112 1989
5,099,393 Electronic package for high density applications 134 1991
5,138,430 High performance versatile thermally enhanced IC chip mounting 140 1991
5,252,857 Stacked DCA memory chips 226 1991
5,198,965 Free form packaging of specific functions within a computer system 77 1991
5,241,454 Mutlilayered flexible circuit package 121 1992
5,243,133 Ceramic chip carrier with lead frame or edge clip 57 1992
5,229,916 Chip edge interconnect overlay element 117 1992
5,343,366 Packages for stacked integrated circuit chip cubes 96 1992
5,313,097 High density memory module 130 1992
5,384,690 Flex laminate package for a parallel processor 27 1993
5,337,388 Matrix of pluggable connectors for connecting large numbers of clustered electrical and/or opticcal cables to a module 41 1993
5,396,573 Pluggable connectors for connecting large numbers of electrical and/or optical cables to a module through a seal 29 1993
5,523,619 High density memory structure 131 1993
5,502,333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit 167 1994
5,620,782 Method of fabricating a flex laminate package 30 1995
6,336,262 Process of forming a capacitor with multi-level interconnection technology 71 1997
5,926,369 Vertically integrated multi-chip circuit package with heat-sink support 106 1998
6,178,093 Information handling system with circuit assembly having holes filled with filler material 81 1998
6,444,490 Micro-flex technology in semiconductor packages 41 2001
6,893,897 Stacked package for integrated circuits 27 2004
 
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5,852,326 Face-up semiconductor chip assembly 64 1998
6,225,688 Stacked microelectronic assembly and method therefor 182 1999
6,465,893 Stacked chip assembly 105 2000
6,765,288 Microelectronic adaptors, assemblies and methods 55 2002
6,897,565 Stacked packages 23 2002
7,149,095 Stacked microelectronic assemblies 31 2002
6,940,158 Assemblies having stacked semiconductor chips and methods of making same 33 2003
6,977,440 Stacked packages 29 2003
6,873,039 Methods of making microelectronic packages including electrically and/or thermally conductive element 12 2003
7,053,485 Microelectronic packages with self-aligning features 13 2003
7,246,431 Methods of making microelectronic packages including folded substrates 12 2003
7,071,547 Assemblies having stacked semiconductor chips and methods of making same 29 2003
6,978,538 Method for making a microelectronic interposer 13 2003
2004/0075,991 Vapor phase connection techniques 39 2003
2004/0217,471 Component and assemblies with ends offset downwardly 39 2004
6,913,949 Stacked packages 23 2004
2004/0245,617 Dense multichip module 48 2004
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6,522,018 Ball grid array chip packages having improved testing and stacking characteristics 56 2000
6,778,404 Stackable ball grid array 35 2000
6,552,910 Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture 155 2000
6,265,660 Package stack via bottom leaded plastic (BLP) packaging 76 2000
6,884,653 Folded interposer 79 2001
6,746,894 Ball grid array interposer, packages and methods 79 2001
6,500,697 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes 18 2001
6,560,117 Packaged microelectronic die assemblies and methods of manufacture 148 2001
6,709,893 Interconnections for a semiconductor device and method for forming same 44 2001
6,559,521 Chip carrier with magnetic shielding 24 2002
2003/0164,551 Method and apparatus for flip-chip packaging providing testing capability 37 2002
 
SAMSUNG ELECTRONICS CO., LTD. (15)
5,594,275 J-leaded semiconductor package having a plurality of stacked ball grid array packages 135 1994
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5,744,827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements 168 1996
5,841,721 Multi-block erase and verification circuit in a nonvolatile semiconductor memory device and a method thereof 82 1997
6,849,949 Thin stacked package 45 2000
6,452,826 Memory module system 96 2001
6,768,660 Multi-chip memory devices and modules including independent control of memory chips 67 2001
6,614,664 Memory module having series-connected printed circuit boards 75 2001
6,781,240 Semiconductor package with semiconductor chips stacked therein and method of making the package 39 2002
6,891,729 Memory module 33 2002
6,876,074 Stack package using flexible double wiring substrate 55 2002
6,812,567 Semiconductor package and package stack made thereof 38 2003
2005/0040,508 Area array type package stack and manufacturing method thereof 41 2004
7,129,571 Semiconductor chip package having decoupling capacitor and manufacturing method thereof 29 2004
2005/0133,897 Stack package with improved heat radiation and module having the stack package mounted thereon 68 2004
 
ROUND ROCK RESEARCH, LLC (11)
6,097,087 Semiconductor package including flex circuit, interconnects and dense array external contacts 300 1997
6,028,365 Integrated circuit package and method of fabrication 261 1998
6,013,948 Stackable chip scale semiconductor package with mating contacts on opposed surfaces 319 1998
5,899,705 Stacked leads-over chip multi-chip module 106 1998
6,072,233 Stackable ball grid array package 300 1998
6,368,896 Method of wafer level chip scale packaging 145 1999
6,165,817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections 47 1999
6,265,766 Flip chip adaptor package for bare die 140 2000
6,465,877 Semiconductor package including flex circuit, interconnects and dense array external contacts 117 2000
6,462,423 Flip-chip with matched lines and ground plane 46 2000
7,115,986 Flexible ball grid array chip scale packages 23 2001
 
INTEL CORPORATION (8)
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5,375,041 Ra-tab array bump tab tape based I.C. package 96 1992
5,362,656 Method of making an electronic assembly having a flexible circuit wrapped around a substrate 76 1994
6,233,650 Using FET switches for large memory arrays 111 1998
6,532,162 Reference plane of integrated circuit packages 27 2001
6,600,222 Stacked microelectronic packages 115 2002
6,869,825 Folded BGA package design with shortened communication paths and more electrical routing flexibility 38 2002
6,841,855 Electronic package having a flexible substrate with ends connected to one another 26 2003
 
FREESCALE SEMICONDUCTOR, INC. (7)
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5,247,423 Stacking three dimensional leadless multi-chip module and method for making the same 165 1992
5,239,198 Overmolded semiconductor device having solder ball and edge lead connective structure 305 1992
5,386,341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 161 1993
5,789,815 Three dimensional semiconductor package having flexible appendages 96 1996
6,040,624 Semiconductor device package and method 93 1997
6,111,761 Electronic assembly 23 1999
 
NEC CORPORATION (7)
5,240,588 Method for electroplating the lead pins of a semiconductor device pin grid array package 63 1992
5,717,556 Printed-wiring board having plural parallel-connected interconnections 78 1996
5,805,422 Semiconductor package with flexible board and method of fabricating the same 133 1997
5,895,970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package 53 1998
6,271,058 Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board 41 1999
6,166,443 Semiconductor device with reduced thickness 36 1999
6,998,704 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus 31 2003
 
TEXAS INSTRUMENTS INCORPORATED (7)
4,712,129 Integrated circuit device with textured bar cover 47 1985
6,084,778 Three dimensional assembly using flexible wiring board 30 1998
6,285,560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified 58 1999
6,689,634 Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability 24 1999
6,489,178 Method of fabricating a molded package for micromechanical devices 68 2001
2002/0114,143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates 31 2002
6,858,910 Method of fabricating a molded package for micromechanical devices 18 2002
 
FUJITSU LIMITED (6)
5,801,439 Semiconductor device and semiconductor device unit for a stack arrangement 106 1997
6,102,710 Controlled impedance interposer substrate and method of making 41 1998
6,187,652 Method of fabrication of multiple-layer high density substrate 77 1998
6,444,921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like 100 2000
6,690,584 Information-processing device having a crossbar-board connected to back panels on different sides 75 2001
6,521,530 Composite interposer and method for producing a composite interposer 94 2001
 
SEIKO EPSON CORPORATION (6)
6,486,544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument 99 2000
6,670,700 Interconnect substrate and semiconductor device electronic instrument 33 2001
6,677,670 Semiconductor device 69 2001
6,867,496 Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument 29 2001
6,489,687 Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment 99 2001
6,646,335 Flexible tape carrier with external terminals formed on interposers 33 2002
 
RAMBUS INC. (5)
6,002,589 Integrated circuit package for coupling to a printed circuit board 77 1997
6,234,820 Method and apparatus for joining printed circuit boards 90 1997
6,447,321 Socket for coupling an integrated circuit package to a printed circuit board 21 1999
6,449,159 Semiconductor module with imbedded heat spreader 99 2000
6,833,984 Semiconductor module with serial bus connection to multiple dies 95 2002
 
APROLASE DEVELOPMENT CO., LLC (4)
4,983,533 High-density electronic modules - process and product 195 1987
5,104,820 Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting 234 1991
6,014,316 IC stack utilizing BGA contacts 110 1998
6,028,352 IC stack utilizing secondary leadframes 103 1998
 
KABUSHIKI KAISHA TOSHIBA (4)
5,394,303 Semiconductor device 226 1993
6,492,718 Stacked semiconductor device and semiconductor system 95 2000
6,528,870 Semiconductor device having a plurality of stacked wiring boards 81 2001
6,956,883 Semiconductor laser device including light receiving element for receiving monitoring laser beam 19 2002
 
QIMONDA AG (4)
6,646,333 Semiconductor module having interconnected semiconductor chips disposed one above the other 16 2000
6,538,895 TSOP memory chip housing configuration 21 2002
6,724,076 Package for a semiconductor chip 28 2003
7,023,701 Device for cooling memory modules 49 2004
 
URENSCHI ASSETS LIMITED LIABILITY COMPANY (4)
5,953,215 Apparatus and method for improving computer memory speed and capacity 158 1998
6,266,252 Apparatus and method for terminating a computer memory bus 114 1999
6,446,158 Memory system using FET switches to select memory banks 116 2000
6,737,891 Tri-directional, high-speed bus switch 12 2002
 
AMP INCORPORATED (3)
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4,696,525 Socket for stacking integrated circuit packages 104 1985
5,259,770 Impedance controlled elastomeric connector 87 1992
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (3)
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5,158,912 Integral heatsink semiconductor package 53 1991
6,588,095 Method of processing a device by electrophoresis coating 53 2001
 
HITACHI, LTD. (3)
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5,159,434 Semiconductor device having a particular chip pad structure 60 1991
6,034,878 Source-clock-synchronized memory system and memory unit 213 1997
 
MITSUBISHI DENKI KABUSHIKI KAISHA (3)
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6,084,294 Semiconductor device comprising stacked semiconductor elements 79 1999
 
MOTOROLA, INC. (3)
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5,432,630 Optical bus with optical transceiver modules and method of manufacture 109 1992
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NATIONAL SEMICONDUCTOR CORPORATION (3)
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6,624,507 Miniature semiconductor package for opto-electronic devices 29 2001
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RENESAS ELECTRONICS CORPORATION (3)
5,357,478 Semiconductor integrated circuit device including a plurality of cell array blocks 69 1991
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XETEL CORPORATION (3)
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6,410,857 Signal cross-over interconnect for a double-sided circuit card assembly 68 2001
 
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5,729,894 Method of assembling ball bump grid array semiconductor packages 105 1996
 
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6,414,384 Package structure stacking chips on front surface and back surface of substrate 68 2000
 
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TALON RESEARCH, LLC (1)
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THOMAS & BETTS CORPORATION (1)
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OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (11)
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5,016,138 Three dimensional integrated circuit package 295 1989
5,281,852 Semiconductor device including stacked die 155 1991
5,397,916 Semiconductor device including stacked die 124 1993
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5,949,657 Bottom or top jumpered foldable electronic assembly 105 1998
6,392,162 Double-sided flexible jumper assembly and method of manufacture 64 2000
2002/0006,032 Low-profile registered DIMM 70 2001
6,509,639 Three-dimensional stacked semiconductor package 78 2002
7,291,906 Stack package and fabricating method thereof 8 2003

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