Circuit module having force resistant construction

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7804985
APP PUB NO 20080308924A1
SERIAL NO

12197674

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Impact resistant circuit modules are disclosed for enclosing a die having a sensor area. Preferred modules include a flexible circuit and a die coupled thereto. The flexible circuit is preferably folded over compressible material to help absorb applied forces. A gap may be provided between sides of the die and the compressible material to help prevent peeling. A metal reinforcing layer may be bonded to the back of the die. A low modulus material including a patterned gap underneath the die may be used to absorb forces. A dry film adhesive may be placed between at least part of the upper surface of the die and the flexible circuit, preferably to provide further point impact resistance and protection. High and low modulus material may be combined in ruggedizing structures. Consumer devices employing such circuit modules are also taught, as well as module construction methods.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
TAMIRAS PER PTE. LTD., LLCDOVER, DE568

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Orris, Ron Austin, US 4 11
Partridge, Julian Austin, US 34 371
Szewerenko, Leland Austin, US 25 128

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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6157541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements 109 1998
 
Honeywell Bull Inc. (1)
4891789 Surface mounted multilayer memory printed circuit board 97 1988
 
INSTITUTE OF MICROELECTRONICS (1)
5925934 Low cost and highly reliable chip-sized package 128 1996
 
F. POSZAT HU, L.L.C. (1)
5959839 Apparatus for heat removal using a flexible backplane 75 1997
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
4645944 MOS register for selecting among various data inputs 79 1984
4903169 Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof 32 1988
 
TALON RESEARCH, LLC (1)
5347428 Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip 299 1992
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
GYRUS ACMI, INC. D.B.A. OLYMPUS SURGICAL TECHNOLOGIES AMERICA (2)
9257763 Hybrid interconnect 0 2013
9510739 Endoscope small imaging system 0 2013
* Cited By Examiner

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