Method of forming orifice plate for fluid ejection device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 5, 2010
Grant Date -
May 26, 2005
app pub date -
Jan 5, 2005
filing date -
Oct 23, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of forming an orifice plate for a fluid ejection device includes depositing and patterning a mask material on a conductive surface, forming a first layer on the conductive surface, forming a second layer on the first layer, and removing the first layer and the second layer from the conductive surface, wherein the first layer includes a metallic material and the second layer includes a polymer material.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully