Chemical mechanical polishing pad having secondary polishing medium capacity control grooves
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United States of America Patent
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Oct 5, 2010
Grant Date -
Dec 21, 2006
app pub date -
May 19, 2006
filing date -
Jun 16, 2005
priority date (Note) -
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Abstract
A chemical mechanical polishing pad (104, 400) that includes a polishing layer (108, 420, 500) having a set of primary grooves (124, 408, 516) formed in a polishing surface (110, 428, 520) of the pad. The pad also includes a set of secondary grooves (128, 404, 504) that become selectively active as a function of the wear of the polishing layer from polishing.
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