US Patent No: 7,807,507

Number of patents in Portfolio can not be more than 2000

Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package

ALSO PUBLISHED AS: 20100047969

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Importance

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Abstract

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A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SAMSUNG ELECTRONICS CO., LTD.SUWON-SI GYEONGGI-DO47589

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chung, Myung-Kee Chungcheongnam-do, KR 12 225
KANG, MYUNG-SUNG - 5 8
Kim, Won-keun Seoul, KR 24 18

Cited Art Landscape

Patent Info (Count) # Cites Year
 
ChipPAC, Inc. (1)
* 7,190,058 Spacer die structure and method for attaching 1 2005
 
HRL LABORATORIES, LLC (1)
* 6,589,811 Method for transferring semiconductor device layers to different substrates 23 2001
 
INVENSAS CORPORATION (1)
* 7,052,934 Fabrication method of semiconductor device 7 2004
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
* 7,135,385 Semiconductor devices having a back surface protective coating 12 2004
 
SONY CORPORATION (1)
* 6,974,711 Method of manufacturing a display panel 2 2005
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
DISCO CORPORATION (1)
* 8,101,504 Semiconductor chip fabrication method 0 2009
 
ULTRATECH, INC. (1)
* 8,138,020 Wafer level integrated interconnect decal and manufacturing method thereof 1 2010
* Cited By Examiner

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