
US Patent No: 7,807,507
Number of patents in Portfolio can not be more than 2000
Backgrinding-underfill film, method of forming the same, semiconductor package using the backgrinding-underfill film, and method of forming the semiconductor package
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Oct 5, 2010
Issued date -
Jun 2, 2009
filing date -
12/476,601
serial no -
In Force
status
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Abstract
A semiconductor package forming method includes mounting a backgrinding-underfill film which includes a laminated backgrinding film and a laminated underfill film on a semiconductor wafer so that the underfill film adheres to a front side of the semiconductor wafer; backgrinding a back side of the semiconductor wafer on which the backgrinding-underfill film has been mounted and removing the backgrinding film of the backgrinding-underfill film from the semiconductor wafer. The method further includes dicing the semiconductor wafer from which the backgrinding film has been removed, so that semiconductor chips are separated from the semiconductor wafer.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 7,190,058 Spacer die structure and method for attaching | 1 | 2005 | |
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| 6,589,811 Method for transferring semiconductor device layers to different substrates | 20 | 2001 | |
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| 7,135,385 Semiconductor devices having a back surface protective coating | 10 | 2004 | |
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| 7,052,934 Fabrication method of semiconductor device | 6 | 2004 | |
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| 6,974,711 Method of manufacturing a display panel | 2 | 2005 | |
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