Probes for a wafer test apparatus
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United States of America Patent
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Oct 5, 2010
Grant Date -
Oct 23, 2008
app pub date -
Feb 16, 2006
filing date -
Feb 24, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.
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