Package and the method for making the same, and a stacked package

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United States of America Patent

PATENT NO 7811858
APP PUB NO 20090039526A1
SERIAL NO

12185879

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Abstract

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A package and the method for making the same, and a stacked package, the method for making the package includes the following steps: (a) providing a carrier having a plurality of platforms; (b) providing a plurality of dice, and disposing the dice on the platforms; (c) performing a reflow process so that the dice are self-aligned on the platforms; (d) forming a molding compound in the gaps between the dice, and (e) performing a cutting process so as to form a plurality of packages. Since the dice are self-aligned on the platforms during the reflow process, a die attach machine with low accuracy can achieve highly accurate placement.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wang, Meng-Jen Kaohsiung, TW 74 713
Wang, Wei-Chung Kaohsiung, TW 88 577

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