Method of making a semiconductor chip assembly with metal pillar and encapsulant grinding and heat sink attachment
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United States of America Patent
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Oct 12, 2010
Grant Date -
N/A
app pub date -
Feb 1, 2009
filing date -
Oct 26, 2006
priority date (Note) -
Expired
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Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a metal pillar on the routing line, forming an encapsulant that covers the chip and the metal pillar, grinding the encapsulant without grinding the metal pillar, then grinding the encapsulant and the metal pillar such that the encapsulant and the metal pillar are laterally aligned, and then attaching a heat sink to the metal pillar.
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