Wafer level pre-packaged flip chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 12, 2010
Grant Date -
Nov 23, 2006
app pub date -
Jul 26, 2006
filing date -
Feb 16, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A pre-packaged flip chip package that includes one or more dice on a semiconductor wafer is disclosed. In the various embodiments, an adhesive layer may be applied to a first side of a finished wafer, having connector pads formed thereon. The adhesive layer may include openings through which the connector pads may be accessed. Conductive elements may be positioned within the adhesive, and configured to electrically couple to the conductive elements.
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