Airflow heat dissipation device
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United States of America Patent
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Oct 19, 2010
Issued Date -
N/A
app pub date -
Nov 20, 2006
filing date -
Oct 27, 2005
priority date (Note) -
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Abstract
Airflow-based heat dissipation is described. A heat sink includes a housing with a first chamber and a second chamber separated by an interface located below the first chamber. The first chamber has sidewalls with first side ports and an access opening. Pins extend from a top surface of the interface into the first chamber. The top surface of the interface has dimples located between the pins and first passageways which extend from the dimples of the top surface to a bottom surface of the interface. The second chamber has a network of tunnels with ends that extend to the sidewalls to provide second side ports. The first passageways extend to the network of tunnels.
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