Formation of circuitry with modification of feature height

United States of America Patent

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Oct 19, 2010
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Nov 14, 2008
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Oct 6, 2003

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Abstract

A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

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TESSERA INC	3025 ORCHARD PARKWAY SAN JOSE CA 95134

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Beroz, Masud	San Jose, US	103	3246
Haba, Belgacem	Saratoga, US	769	23924
Kim, Young-Gon	San Jose, US	39	746
Tuckerman, David B	Lafayette, US	241	6551

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Formation of circuitry with modification of feature height

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United States of America Patent

12291853

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US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 19, 2010	US,7816251,B2 US7816251B2	GRANTED PATENT AS SECOND PUBLICATION
March 19, 2009	US,20090071000,A1 US20090071000A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7816251
SERIAL NO	12291853
DOCKET NO

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12291853

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