Ball grid array package construction with raised solder ball pads
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United States of America Patent
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Oct 19, 2010
Issued Date -
N/A
app pub date -
Jun 13, 2007
filing date -
Jan 16, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised face and a plurality of vertical conductive walls and a BGA solder ball having an average diameter of greater than the width of the raised face, the BGA solder ball being adhered to the raised face and to a substantial portion of the vertical conductive walls.
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Cited Art Landscape
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