Method of producing an electronic component with flexible bonding
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 26, 2010
Grant Date -
Sep 22, 2005
app pub date -
May 6, 2005
filing date -
Jun 17, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for producing an electronic component with an electronic circuit and electrical contacts, disposed at least on a first surface of the electronic component, for the electrical bonding of the electronic circuit includes at least one flexible elevation of an insulating material disposed on the first surface, at least one electrical contact disposed on the flexible elevation, and a conduction path disposed on the surface or in the interior of the flexible elevation between the electrical contact and the electronic circuit.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully