Semiconductor die package including leadframe with die attach pad with folded edge
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United States of America Patent
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Oct 26, 2010
Grant Date -
Aug 7, 2008
app pub date -
Feb 5, 2007
filing date -
Feb 5, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor die package is disclosed. The semiconductor die package comprises a leadframe structure with a die attach pad including a die attach surface, a folded edge structure and an opposite surface opposite to the die attach surface. A plurality of leads extending laterally away from the die attach pad. A semiconductor die comprising a first surface and a second surface is attached to the semiconductor die, and a molding material is around at least a portion of the leadframe structure and at least a portion of the semiconductor die. The opposite surface is exposed through the molding material and terminal ends of the leads do not extend past lateral edges of the molding material.
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