Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness
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United States of America Patent
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Oct 26, 2010
Grant Date -
Mar 5, 2009
app pub date -
Aug 18, 2008
filing date -
Sep 3, 2007
priority date (Note) -
Expired
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Abstract
as a factor, a magnetic flux change part to forecast a polishing end point in the magnetic flux change process is detected, and a polishing end point is forecasted from the magnetic flux change part, and a polishing rate and a remaining film thickness amount to be removed are calculated on the spot.
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