Housing for a power module
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United States of America Patent
Stats
-
Oct 26, 2010
Grant Date -
Jan 22, 2009
app pub date -
Nov 8, 2007
filing date -
Nov 8, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.
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