Fingerprint sensing device having flexible printed circuit board serving as signal transmission structure and the method of manufacturing the same
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United States of America Patent
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Oct 26, 2010
Grant Date -
Feb 12, 2009
app pub date -
Aug 7, 2008
filing date -
Aug 10, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A fingerprint sensing device includes a chip substrate, first connecting pads and a flexible printed circuit board. The substrate has fingerprint sensing cells. The first connecting pads are respectively disposed on the fingerprint sensing cells and exposed from a top surface of the substrate. The printed circuit board is disposed above the substrate and has signal transmission structures exposed from a bottom surface of the printed circuit board. The fingerprint sensing cells are respectively electrically connected to the signal transmission structures, and a top surface of the printed circuit board serves as a contact surface for a finger so that sensed fingerprint signals of the finger are transmitted to the fingerprint sensing cells through the signal transmission structures. The numbers of the first connecting pads, the fingerprint sensing cells and the signal transmission structures are equal to one another. A method of manufacturing the fingerprint sensing device is also disclosed.
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