Embossing method and apparatus
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United States of America Patent
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Nov 2, 2010
Issued Date -
N/A
app pub date -
May 13, 2003
filing date -
May 13, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method and apparatus for forming a patterned layer having a surface profile that provides relief structures within an electronic device. The method comprises the steps of taking a carrier film (50) having an inverse of the required surface profile formed on one side thereof, taking a layer of fixable material (54) located on a substrate (52), laminating the carrier film (50) and substrate (52) such the carrier film causes the required surface profile to be formed in the layer of fixable material with a predetermined offset, and then fixing the fixable material. Lamination may be performed using rollers (56,58) or a vacuum process. The process is designed to ensure that the offset can be kept as low as possible, preferably to within 150 nm.
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