Thermoplastic elastomer with acyloxyphenyl hard block segment
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United States of America Patent
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Nov 2, 2010
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N/A
app pub date -
Dec 19, 2007
filing date -
Dec 19, 2006
priority date (Note) -
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Abstract
The present invention provides curatives for thermosetting adhesive compositions, methods of preparation and uses thereof. In particular, the present invention relates to elastomeric epoxy curative compounds that can be used in thermosetting compounds, methods for preparing the curative compounds and epoxy compositions containing the curative compounds.
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