Supply mechanism for the chuck of an integrated circuit dicing device
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United States of America Patent
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Nov 9, 2010
Issued Date -
N/A
app pub date -
Aug 23, 2005
filing date -
Aug 23, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A system for dicing substrates to singulate integrated circuit units within in them includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax,Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4).
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