Electroplating an yttrium-containing coating on a chamber component
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United States of America Patent
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Nov 16, 2010
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N/A
app pub date -
Jun 21, 2007
filing date -
Jan 8, 2002
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Abstract
A method of forming a component capable of being exposed to a plasma in a process chamber comprises forming a structure comprising a surface and electroplating yttrium, and optionally aluminum or zirconium, onto the surface. Thereafter, the electroplated layer can be annealed to oxide the yttrium and other electroplated species.
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