Thin film capacitor, high-density packaging substrate incorporating thin film capacitor, and method for manufacturing thin-film capacitor
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United States of America Patent
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Nov 23, 2010
Issued Date -
N/A
app pub date -
Dec 29, 2006
filing date -
Oct 31, 2003
priority date (Note) -
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Abstract
A capacitor capable of being incorporated into a packaging substrate, which capacitor includes a high-dielectric-constant layer, and an upper electrode layer and a lower electrode layer sandwiching the high-dielectric-constant layer from the upper side and the lower side. A packaging substrate containing the capacitor, and a method for producing the same are also provided.
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