Thermal management system for evaporative spray cooling
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United States of America Patent
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Nov 23, 2010
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N/A
app pub date -
Sep 27, 2002
filing date -
Sep 27, 2002
priority date (Note) -
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Abstract
A thermal management system configured to maximize the potential of single and multiple atomizers to effectively cool microprocessors and other electronic devices. The thermal management system, which may be a heat spreader, provides surfaces that are disposed to increase the effectiveness of impinging coolant droplets, provide additional heat transfer area in some embodiments, and permit the efficient, customized and disparate thermal management of a recipient object of the thermal management.
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