Flat leadless packages and stacked leadless package assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Nov 30, 2010
Grant Date -
Aug 20, 2009
app pub date -
Aug 27, 2008
filing date -
Feb 19, 2008
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
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