Importance

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Abstract

In this invention, etching is not performed in the step of planarizing a polycrystalline Si wafer, but only mechanical grinding is performed for planarization. This is because, since the etching rate is crystal-face dependent, etching of the polycrystalline Si wafer unavoidably results in formation of steps due to different crystal face orientations of individual crystal grains exposed on a surface of the wafer, thus hindering precision surface planarization. Subsequently, the Si wafer surface is coated with an oxide film to form an Si wafer with oxide film prior to the final polishing stage and then a surface of the oxide film is planarized, to give a planar substrate (i.e., Si substrate with oxide film) having no step on the surface thereof.

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First Claim