Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
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United States of America Patent
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Dec 14, 2010
Grant Date -
Dec 10, 2009
app pub date -
Jun 5, 2008
filing date -
Jun 5, 2008
priority date (Note) -
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Abstract
Methods of fabricating an electromechanical systems device that mitigate permanent adhesion, or stiction, of the moveable components of the device are provided. The methods provide an amorphous silicon sacrificial layer with improved and reproducible surface roughness. The amorphous silicon sacrificial layers further exhibit excellent adhesion to common materials used in electromechanical systems devices.
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