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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ASAHI GLASS COMPANY LIMITED	5-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 1008405 ?1008405
SEIMI CHEMICAL CO LTD	KANAGAWA KANAGAWA

International Classification(s)

• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
• C09C:TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBRO....
• B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kon, Yoshinori	Yokohama, JP	12	83
Nakazawa, Norihito	Yokohama, JP	12	294
Takemiya, Satoshi	Yokohama, JP	19	133

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 21, 2010	US,7854777,B2   US7854777B2	GRANTED PATENT AS SECOND PUBLICATION
October 07, 2004	US,20040194392,A1   US20040194392A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7854777

Polishing compound, method for production thereof, and polishing method

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