Device and method for treating the surfaces of substrates
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United States of America Patent
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Jan 4, 2011
Grant Date -
Oct 2, 2008
app pub date -
Jun 12, 2008
filing date -
Dec 16, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane.
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