Image sensor package and forming method of the same
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United States of America Patent
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Jan 4, 2011
Issued Date -
N/A
app pub date -
May 8, 2008
filing date -
Dec 8, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An image sensor package comprises a substrate, a chip mounted over the substrate. A molding material is formed surrounding the chip to expose a micron lens area, wherein the molding material includes via structure passing there through. A protection layer is formed on the micro lens area to prevent the micro lens. A redistributed conductive layer is formed over the molding material to connect to a pad of the chip. Metal pads are formed on via structure as connecting points with PCB. A cover layer is formed over the substrate to isolate the metal pads.
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