Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive

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United States of America Patent

PATENT NO 7863374
APP PUB NO 20080119607A1
SERIAL NO

11434216

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Self-curable water-based solid adhesives of this invention include the following components (A), (B), (C), and (D):(A) an anionic-group-containing polymer terminally having an alkoxysilyl group, the polymer being a reaction product of a compound (A1) containing no anionic group and having plural isocyanate-reactive groups, a compound (A2) having an anionic group and plural isocyanate-reactive groups, a polyisocyanate compound (A3), and an alkoxysilane compound (A4) containing an isocyanate-reactive group;(B) a basic compound;(C) water; and(D) a gelling agent.The self-curable water-based solid adhesives of the present invention can be applied with good workability, have good fitting after attachment, have good adhesion to plastics, metals and glass and exhibit excellent heat resistance and water resistance after curing. They are highly safe to humans and the environment. They also have excellent shape retention and slidability and can be easily applied. In addition, they can bond adherends by contact bonding despite that they are water-based solid adhesives. Accordingly, the self-curable water-based solid adhesives of this invention are very useful as stick adhesives.

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Patent Owner(s)

Patent OwnerAddress
KONISHI CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hamada, Shinsa Osaka, JP 2 12
Harada, Kuniharu Osaka, JP 3 20
Idemoto, Kenji Osaka, JP 3 12
Shibahara, Syunsuke Osaka, JP 2 12
Ueji, Kenji Osaka, JP 6 101

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