Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 4, 2011
Grant Date -
Jun 28, 2007
app pub date -
Aug 25, 2006
filing date -
Dec 22, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A laser processing apparatus is provided. The laser processing apparatus is for performing pattern processing of a transparent conductive film that is formed on a multilayer film on a substrate by using laser light, includes debris extraction module having a vortex generation mechanism that generates a vortex flow by directing gas into the vicinity of a laser-irradiated portion of the transparent conductive film. The debris extraction module is disposed close to the substrate, and debris before deposition and after deposition on the substrate, which is generated by laser irradiation, is entrapped into the vortex flow to be extracted to the outside with the gas.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully