Dual-sided chip attached modules
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United States of America Patent
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Jan 4, 2011
Grant Date -
Mar 12, 2009
app pub date -
Aug 6, 2008
filing date -
May 16, 2006
priority date (Note) -
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Abstract
An electronic device and method of packaging an electronic device. The device including: a first substrate, a second substrate and an integrated circuit chip having a first side and an opposite second side, a first set of chip pads on the first side and a second set of chip pads on the second side of the integrated circuit chip, chip pads of the first set of chip pads physically and electrically connected to corresponding substrate pads on the first substrate and chip pads of the second set of chip pads physically and electrically connected to substrate pads of the substrate.
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