Integrated circuit package system with wire bond pattern
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United States of America Patent
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Jan 4, 2011
Issued Date -
N/A
app pub date -
Apr 1, 2006
filing date -
Apr 1, 2006
priority date (Note) -
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Abstract
An integrated circuit package system including providing a plurality of substantially identical package leads formed in a single row, and attaching bond wires having an offset on adjacent locations of the package leads.
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