Semiconductor chip, method of fabricating the same and semiconductor chip stack package
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United States of America Patent
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Jan 4, 2011
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N/A
app pub date -
Dec 19, 2008
filing date -
Dec 21, 2007
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Abstract
Provided are a semiconductor chip, a method of fabricating a semiconductor chip, and a semiconductor chip stack package. The semiconductor chip includes a semiconductor substrate and a semiconductor device on the semiconductor substrate. A dielectric covers the semiconductor device. A top metal is on the dielectric and electrically connected to the semiconductor device. A deep via penetrates the semiconductor substrate and the dielectric. An interconnection connects the deep via and the top metal electrically. A bump is in contact with the top metal and the interconnection.
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