Probe card cooling assembly with direct cooling of active electronic components
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United States of America Patent
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-
Jan 4, 2011
Grant Date -
Mar 4, 2010
app pub date -
Aug 25, 2009
filing date -
Dec 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe card cooling assembly for use in a test system includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components and at least one coolant port that allows a coolant to enter the high-density package and directly cool the active electronic components of the dies during a testing operation.
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