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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MATSUI MFG CO LTD	OSAKA 542-0012

International Classification(s)

• B65B:MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF,....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hanaoka, Kazunari	Hirakata, JP	11	203
Kimura, Harumoto	Hirakata, JP	1	2
Nakano, Riichi	Ohbu, JP	2	24
Oyama, Yousuke	Ohbu, JP	1	2

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 11, 2011	US,7866352,B2   US7866352B2	GRANTED PATENT AS SECOND PUBLICATION
September 11, 2008	US,20080217802,A1   US20080217802A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7866352

Filling method and filling apparatus of powder-particle material in compression molding

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