Polishing pad

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United States of America Patent

PATENT NO 7867066
APP PUB NO 20080064311A1
SERIAL NO

11813141

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing pad having a novel structure, which is applicable to highly accurate various polishing process, such as a CMP process, is provided. An annular rear plane groove (22) extending in a circumferential direction is formed on a rear plane (20) of the polishing pad.

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Patent Owner(s)

  • INOAC CORPORATION;TOHO ENGINEERING KABUSHIKI KAISHA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Suzuki, Tatsutoshi Yokkaichi, JP 16 149

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