Method for manufacturing a microstructure, exposure device, and electronic apparatus

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United States of America Patent

PATENT NO 7867692
SERIAL NO

11153553

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Abstract

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Aspects of the invention can provide a method for manufacturing a microstructure, including forming a photosensitive film above a work piece, exposing the photosensitive film, as a first exposure, by irradiating interference light generated by intersecting two laser beams having a wavelength shorter than a wavelength of visible light, developing the exposed photosensitive film so as to develop a shape corresponding to a pattern of the interference light to the photosensitive film, and etching the work piece using the developed photosensitive film as an etching mask.

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Patent Owner(s)

Patent OwnerAddress
SEIKO EPSON CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amako, Jun Matsumoto, JP 60 1304
Sawaki, Daisuke Suwa, JP 38 474
Takakuwa, Atsushi Shiojiri, JP 44 547

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