Electronic component structure and method of making
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United States of America Patent
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Jan 11, 2011
Grant Date -
Aug 28, 2008
app pub date -
May 22, 2007
filing date -
Feb 26, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.
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