System and method for forming an integrated barrier layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2011
Issued Date -
N/A
app pub date -
Jun 29, 2007
filing date -
Apr 16, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus and method for forming an integrated barrier layer on a substrate is described. The integrated barrier layer comprises at least a first refractory metal layer and a second refractory metal layer. The integrated barrier layer is formed using a dual-mode deposition process comprising a chemical vapor deposition (CVD) step and a cyclical deposition step. The dual-mode deposition process may be performed in a single process chamber.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully