Low shrinkage polyester thermosetting resins
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 11, 2011
Issued Date -
N/A
app pub date -
Apr 11, 2007
filing date -
Apr 11, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention is based on the discovery that a certain polyester compounds are useful as b-stageable adhesives for the microelectonic packaging industry. The polyester compounds described herein contain ring-opening or ring-forming polymerizable moieties and therefore exhibit little to no shrinkage upon cure. In addition, there are provided well-defined b-stageable adhesives useful in stacked die assemblies. In particular, there are provided assemblies wherein the b-stageable adhesive encapsulates a portion of the wiring members contained within the bondline gap between the stacked die.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully