Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
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United States of America Patent
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Jan 11, 2011
Grant Date -
Jun 5, 2008
app pub date -
Dec 21, 2007
filing date -
Jul 1, 1998
priority date (Note) -
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Abstract
A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material between a substrate and a semiconductor chip; a second step in which pressure and heat are applied between the semiconductor chip and the substrate, an interconnect pattern and electrodes are electrically connected, and the anisotropic conductive material is spreading out beyond the semiconductor chip and is cured in the region of contact with the semiconductor chip; and a third step in which the region of the anisotropic conductive material other than the region of contact with the semiconductor chip is heated.
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