Method and apparatus for self-referenced wafer stage positional error mapping
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United States of America Patent
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Jan 18, 2011
Grant Date -
Sep 21, 2006
app pub date -
Apr 6, 2006
filing date -
Dec 8, 2000
priority date (Note) -
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Abstract
Intra-field distortion for a projection imaging tool is determined using a self-referenced rectangular grid reticle pattern, that includes at least two arrays of alignment attributes that are complementary to each other, is exposed multiple times onto a substrate with a recording media. A reference reticle pattern is exposed onto the substrate, wherein the reference reticle pattern overlaps the grid alignment attributes thereby creating completed grid alignment attributes. Positional offsets of the completed alignment attributes and completed grid alignment attributes are measured and an intra-field distortion from the offsets is determined.
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