Method and apparatus for manufacturing stacked-type semiconductor device
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United States of America Patent
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Jan 18, 2011
Grant Date -
Feb 23, 2006
app pub date -
Aug 10, 2005
filing date -
Aug 11, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of manufacturing a stacked-type semiconductor device, comprises: arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate; connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips; performing plastic molding of each stacked chip; and separating the stacked chips from each other; an apparatus for manufacturing a stacked-type semiconductor device, comprising divided heater blocks formed under a support substrate on which a plurality of stacked chips obtained by stacking a plurality of semiconductor chips are arranged, the divided heater blocks being formed with respect to the stacked chips, and a heating device to selectively transmit heat to a stacked chip subjected to a wire bonding.
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