Lead frame-BGA package with enhanced thermal performance and I/O counts
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United States of America Patent
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Jan 18, 2011
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app pub date -
Nov 30, 2007
filing date -
Jun 8, 2007
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Abstract
Methods and apparatus for integrated circuit (IC) packages with improved thermal performance and input/output capabilities are described. An integrated circuit (IC) package includes a leadframe, an IC die, a substrate having opposing first and second surfaces, a first wirebond, and a second wirebond. The leadframe includes a die attach pad having opposing first and second surfaces and a plurality of leads that emanate in an outward direction from the die attach pad. The IC die is coupled to the first surface of the die attach pad. The substrate is coupled to the die attach pad. Contact pads on the first surface of the substrate are electrically connected to bond fingers on the second surface of the substrate. The first wirebond couples a first bond pad on a first surface of the IC die to a bond finger on the second surface of the substrate. The second wirebond couples a second bond pad on the first surface of the IC die to a lead of the plurality of leads.
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