Methods of fabricating MEMS devices having overlying support structures
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United States of America Patent
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Jan 25, 2011
Grant Date -
Jan 28, 2010
app pub date -
Jul 27, 2009
filing date -
Jul 22, 2005
priority date (Note) -
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Abstract
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
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