Resin for composite structures
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United States of America Patent
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Jan 25, 2011
Grant Date -
May 24, 2007
app pub date -
Nov 23, 2005
filing date -
Nov 23, 2005
priority date (Note) -
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Abstract
A resin precursor composition for use in the production of composite components includes an isocyanate component comprising a material selected from the group consisting of diphenylmethane diisocyanate, a polymeric isomer of diphenylmethane diisocyanate, and combinations thereof. The resin precursor composition also includes at least one polyether polyol having a functionality of three in an amount such that the ratio of the isocyanate component to the at least one polyol is between approximately 80% and 115% of stoichiometric. The resin precursor composition also includes a mold release material and a filler material.
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