Semiconductor chip package
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United States of America Patent
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Jan 25, 2011
Grant Date -
Sep 24, 2009
app pub date -
Mar 18, 2008
filing date -
Mar 18, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.
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