Component fixing method
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United States of America Patent
Stats
-
Feb 1, 2011
Grant Date -
Nov 20, 2008
app pub date -
May 8, 2008
filing date -
May 11, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A resist having a predetermined thickness is formed on a printed circuit board except for portions of the printed circuit board that oppose a convex portion of a component when the component is mounted on the printed circuit board. A silk screen printed layer having a predetermined thickness is formed on the resist. Thereafter, a concave portion of the component is bonded to the silk screen printed layer using double coated tape having a predetermined thickness. The component is mounted such that the convex portions of the component oppose the portions of the printed circuit board that do not have a resist formed thereon. The sum of the thicknesses of the resist, the silk screen printed layer and the double coated tape is larger than a height difference between the concave portion and the convex portion of the component.
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