Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material
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United States of America Patent
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Feb 1, 2011
Grant Date -
Sep 29, 2005
app pub date -
Mar 28, 2005
filing date -
Mar 26, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly bonded to the base material surface and having at least a group selected from a group consisting of: a polar group; a functional group whose hydrophilicity/hydrophobicity changes, whose structure is changed into a structure that interacts with an electroless plating catalyst or a precursor thereof, or which ceases to interact with an electroless plating catalyst or a precursor thereof in response to heat, acid or radiation; and a polymerizable functional group, is generated in a pattern shape using the active site as a starting point so that a pattern is formed on the surface of the base material.
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