Process for making contact with and housing integrated circuits
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United States of America Patent
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Feb 1, 2011
Grant Date -
Mar 18, 2010
app pub date -
Nov 20, 2009
filing date -
Aug 24, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.
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